MediaTek, a prominent player in the semiconductor industry, has introduced its latest flagship chipset, the Dimensity 9300. This new chipset is set to compete directly with Qualcomm’s Snapdragon 8 Gen 3, powering the upcoming wave of Android flagship smartphones from Chinese manufacturers.
The Dimensity 9300 is built on TSMC’s cutting-edge third-generation 4nm+ process node, and its most notable feature is its unique all-big core CPU design. It comprises four Cortex-X4 cores clocked at an impressive 3.25GHz and four Cortex-A720 cores running at 2.0GHz, all based on the Armv9 architecture. MediaTek claims that the Dimensity 9300 offers a substantial 40% improvement in peak performance compared to last year’s Dimensity 9200 while consuming 33% less power.
In addition to the CPU, the Dimensity 9300 features a 12-core Immortalis-G720 MC13 GPU with hardware-based ray tracing, delivering a remarkable 46% improvement in performance over its predecessor while reducing power consumption by 40%. The chipset also supports the latest LPDDR5T RAM with speeds of up to 9,600Mbps and UFS 4.0 storage with Multi-Circular Queue (MCQ) support.
Artificial Intelligence (AI) tasks are efficiently managed by the APU 790, which supports Generative AI with Stable Defusion generation in less than one second and offers support for LLM with up to 33 billion parameters. The Dimensity 9300 also brings support for screens with up to WQHD resolution and 180Hz refresh rates, as well as dual-active displays for foldable smartphones.
For image capture, the Dimensity 9300 relies on the Imagiq 990 Image Signal Processor (ISP) with always-on High Dynamic Range (HDR) capabilities and a standalone image stabilization module. The ISP can handle video recording at impressive resolutions, supporting up to 8K video at 30 frames per second or 4K at 30/60 frames per second with cinematic mode and real-time bokeh effects. The R16 5G modem supports 4CC-CA Sub-6GHz and 8CC-CA mmWave bands, promising improved power efficiency thanks to MediaTek’s UltraSave 3.0+ technology.
The upcoming vivo X100 series, set to launch in China tomorrow, is expected to be the first to feature the new Dimensity 9300 platform. It is likely that more Android device manufacturers will pledge their support for this new chipset in the days to come.